Interpreting Standardization Readiness Levels for Chip R&D: Comparative Analysis and Dynamic Evolution Model Based on the NIST Framework
DOI:
https://doi.org/10.62306/xnr8xn54Keywords:
chip R&D, Standardization Readiness Level (SRL), NIST framework, EU SRL system, Japanese JIS Chip SRL framework, dynamic evolution model, system dynamics, technology-industry-policy (TIP)Abstract
The Standardization Readiness Level (SRL) in chip development serves as a critical metric for evaluating the transformation of technological achievements into industry standards. This study focuses on the 2026 "Summary Report on Chip Development Standardization Readiness Levels" (hereinafter referred to as the "NIST Report") published by the National Institute of Standards and Technology (NIST), systematically analyzing its SRL framework design logic, hierarchical definitions, and implementation processes. By comparing the supporting standard system of the EU's "European Chips Act" with the standardization framework of Japan's Ministry of Economy, Trade and Industry (METI) "Semiconductor Strategy 2.0," the study reveals similarities and differences in SRL practices across different institutional environments. Furthermore, a three-dimensional dynamic evolution model integrating "technology-industry-policy" dimensions is constructed to simulate SRL progression throughout the entire chip development lifecycle. Findings indicate that the NIST framework centers on "collaborative validation," achieving closed-loop management from concept to standardization through five-tiered hierarchical structures. The EU system emphasizes cross-border resource integration but faces limitations in decision-making efficiency, while the Japanese framework prioritizes corporate leadership but encounters international compatibility challenges. Dynamic modeling demonstrates that policy support and industrial collaboration serve as core drivers for SRL upgrades. This study provides theoretical references and practical guidance for optimizing standardization strategies among chip development stakeholders and enhancing standard systems for policymakers